Ex-situ stress measurement system SIG-500SP

Field of application

The stress measurement system SIG-500SP is optimized to measure the stress ex-situ in thin films deposited on reference substrates. It is very easy and quick to use and can be installed in every clean-room, e.g. just next to the deposition system. So it is possible to measure samples from every coating charge. Therefore the system improves the quality control and accelerates film development processes.

The principle:

Schematic SIG-500SP

Technical data:

Resolution: Better than +-15 MPa in a 100nm thin film coated on a 150µm thick Silicon substrate
Substrates: Nearly all materials.
One mirrored side with a reflectivity of at least 3%.
Typical thicknesses range from 100 microns to 1000 microns.
Sample holder: Available for substrate sizes less than 100mm x 100mm.
Due to the 45° slope the samples can be positioned with accuracy better than 0.1mm.
Detector: CCD line detector
Laser / Optic: 650nm diode laser module. Other wavelengths available. Beam splitter produces two beams with a separation of 20mm. LASER CLASS I.
Size: 45cm x 15cm x18cm
Weight: 18kg
Software: Special Software with data export to e.g. ".csv"-files. The complete history of measurements is saved in a clear structured database.

Example measurement:

Graphic example measurement