The stress measurement system SIG-500SP is optimized to measure the stress ex-situ in thin films deposited on reference substrates. It is very easy and quick to use and can be installed in every clean-room, e.g. just next to the deposition system. So it is possible to measure samples from every coating charge. Therefore the system improves the quality control and accelerates film development processes.
|Resolution:||Better than +-15 MPa in a 100nm thin film coated on a 150µm thick Silicon substrate|
|Substrates:||Nearly all materials.
One mirrored side with a reflectivity of at least 3%.
Typical thicknesses range from 100 microns to 1000 microns.
|Sample holder:||Available for substrate sizes less than 100mm x 100mm.
Due to the 45° slope the samples can be positioned with accuracy better than 0.1mm.
|Detector:||CCD line detector|
|Laser / Optic:||650nm diode laser module. Other wavelengths available. Beam splitter produces two beams with a separation of 20mm. LASER CLASS I.|
|Size:||45cm x 15cm x18cm|
|Software:||Special Software with data export to e.g. ".csv"-files. The complete history of measurements is saved in a clear structured database.|